Il Prof. Rajiv Asthana,
Department of Engineering and Technology
University of Wisconsin-Stout
Menomonie, WI 54751, USA
terrà un seminario dal titolo:
Active Metal Brazing and Diffusion Bonding of Advanced Ceramic and Metallic Materials
Il seminario avrà luogo il giorno venerdì 25 Novembre 2016, alle ore 10:00, presso ICMATE-CNR - Genova, Via de Marini 6 - Sala Leonardo, Area della Ricerca, 11 piano.
Abstract
Robust joining technology is central to manufacture of complex parts made from difficult-to-machine materials such as ceramics. Over the last decade, a number of joining concepts and technologies were demonstrated to integrate ceramics, ceramic-matrix composites, and porous carbon-base materials to high-temperature alloys for structural, functional, and thermal management applications such as heat exchangers, fuel cells, fuel injectors, gas turbines and other systems. Vacuum brazing and diffusion bonding were used as preferred integration techniques for such applications. Judiciously selected active fillers with or without compliant metal interlayers (to mitigate the residual stress) were used to demonstrate bonding of dissimilar materials that included ZrB2, C/C, carbon foam, SiC, YSZ, and Al2O3 bonded to Ti, Ni-base superalloys, steels and copper-clad-Mo, among others. The presentation will provide an overview of the theoretical foundation and processing technology of ceramic brazing and diffusion bonding with a focus on recent work on joining of technical ceramics to high-temperature metals and alloys.
File allegati
